Void-closure behavior and a new void-evolution model for various stress states
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Materiali in tehnologije
سال: 2021
ISSN: 1580-2949,1580-3414
DOI: 10.17222/mit.2020.128